ON Semiconductor SR AL WIRE BOND PROCESS ENGR in Suzhou, China

  1. Sustain WB production and OCAP/QCN disposition.

  2. Lead the WB accumulate yield improvement project.

  3. Provide technical analysis and responsible EFAR actions.

  4. Lead WB related cost reduction projects.

  5. Work with other dept for process sustaining, as hold lot disposition, test maverick lot disposition.

  6. Package design/Tooling design review and optimization.

  7. Generate case analysis report/project report/Weekly report for management review.

  8. Coach other new WB engineer on Al wire bonding technologies.

  9. Wire bonding process engineering background with at least 8 years working experience.

  10. Familiar with OE7200, Choonpa wire bonding machine.

  11. Positive, hard and high efficiency work style.

  12. Strong team communication and team work skill.

  13. Fluent English speaking with good writing.

Job: Engineering


Location: CN-CN-Suzhou

Requisition ID: 1801334

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