ON Semiconductor SMT Process Engineer in Suzhou, China

  • Responsible for for surface-mount technology (SMT) and Solder/Epoxy Die Attach (DA)processes for NPI development projects and post code-s activities

  • Follow projects APQP phase requirements, provide documentation, line training and respond to internal and external customers

  • Provide technical advice to development engineer/ leader (ATPDG and ATNPI technical lead) as well as other cross-functional team regarding process design, tooling design and process control to reduce the potential risk items impact to quality, yield, cost and delivery

  • Attend design reviews to brainstorm, analyze, and highlight design potential risk to mass production

  • Review build diagram of new products and derivative products compliance to design rule specs, manufacturability and lessons learned

  • Responsible to raise technical constraints which will have major impact to project quality, cost, yield, and delivery

  • Responsible to secure POR /BOM to meet NPI and BE manufacturing KPI requirements

  • Review, validate, accept / reject design concept from the technology group and package development for new product introduction from design review APQP Phase zero

  • Review, validate, accept / reject characterized POR (process flow, material and process parameters) established by ATPDG PE based on manufacturing capability on or before line certification

  • Ensure project documents, engineering reports, work-instruction, OCAP procedure, process parameters, bin limit, tooling drawings are reviewed and draft are uploaded to database every phase as well as finalized before product release

  • Conduct training to manufacturing, process engineer, technician, operator, and trainer designate before line validation or line certification

  • Be responsible to create mitigation plan involving cross-functional team to quickly resolve issues found during line certification/safe launch/post code-s for the derivative devices

  • Provide report and share to related persons closed loop activities for continuous improvement of NPI by lesson learn, Design rule revision and APQP deliverable update

  • Lead the team to use PFMEA/CP/DOE/Red X/Six Sigma as the continuous improvement tools to improve process capability towards zero defects from development to post code-s monitoring

  • Lead the team to improve NPI process quality, address the customer complaints, prevent the recurrence and improve top process PPM defects

  • Involves PE team for post code S activities on quality, yield and cost to ensure smooth handover until the project hands over

  • Host buy off and hands over meeting with process engineering and cross-functional team to present post code S monitor results of yield trends, failure modes with pareto analysis, maverick MRB history, actions, LRR, RMP, compare to Line certification.

  • Responsible to hold MRB meeting when for line shut down by maverick, QCN, OCAP, RMP failure potential failure mode caused by/potentially caused by owned process and provide report and update together with related document in control database

  • Responsible to generate 8D report for PQA related to NPI product released within 2 years under ATNPI post-code s monitoring

  • Support customer visit, audits and provide data with the highest priority and urgency

  • Responsible to qualify automotive process and personnel, collaborates with equipment engineering and QA team to qualify automotive designated equipment.

  • Other responsibility to be assigned based on the business need.

  • Bachelors in Engineering preferably Materials Engineering or Mechanical Engineering

  • masters degree in engineering or other related discipline is a plus

  • Experience 5 years minimum focused in surface-mount technology (SMT) process

  • 2 years and above experience in soft solder or epoxy die-attach is a plus

  • Can independently do machine set-up and buy-off equipment especially platforms: Yamaha SMT, and ESEC, ASM die bonders or other equivalent platforms

  • Have deep understanding and hands-on experience of surface-mount technology (SMT)material, equipment and their interaction

  • Have practical and theoretical knowledge on APQP procedure, DFMEA, PFMEA, Control Plan, DOE

  • Have good statistical analysis and decision making skills

  • Confident and fluent in oral and written both Chinese and English (min CET6)

  • Be able to write good technical/engineering report

  • Have good leadership, interpersonal relationship and negotiation skills

  • Positive attitude towards work, proactive, self motivated, open-minded, can work under high pressure

Job: Engineering

Title: SMT Process Engineer

Location: CN-CN-Suzhou

Requisition ID: 1802189

ON Semiconductor is an Equal Employment Opportunity Employer and prohibits discrimination on the basis of age, race, color, religion, gender, sexual orientation, national origin, citizenship, protected veteran status, disability status, or any other federal, state or local protected classes. ON is committed to providing equal employment opportunity to qualified individuals, regardless of protect class status.