ON Semiconductor External Manufacturing Engineer in Shanghai, China

Responsible for providing over-all technical and engineering support to ON Semiconductor’s Assembly/Test subcontractors located globally to ensure ON Semiconductor’s product requirements from a customer, regulatory standards, quality, process and yield are met and sustained. Continue to work on process improvements from a business processes model or manufacturing process improvements.

  1. Assembly process sustaining (50%)

•Provides timely disposition to subcontractor process issues and requires/reviews corrective actions for both short term and long term prevention/improvement in order to consistently meet yield target for all lots

•Review quality incidents and analyze with subcontractors process capability in order to prevent major/catastrophic quality incidences.

•Review process stability in subcontractors and propose process simplification in order to improve process flow.

•Execute qualification activities related to new subcontractor, change in process or BOM, cost improvements, process simplification to eliminate NVA processes and etc which requires Assembly engineering expertise from packaging or process.

Metric : Yield for new device ramp, EFARS, Projects

  1. Technical Support (35%)

•Provides technical support to Package development and assembly subcontractor’s for new device, package or product development to ensure smooth production transfer.

•Support EBR (Engineering Builds) on all subcons for detailed requirement.

•Revise specification/documentation as and when needed.

Metric : KPI Management, Performance appraisal, People development (Technical & Non Technical)

  1. Audits (10%)

Performs qualification and process audits of assembly subcontractors to ensure new and/or existing subcons comply to their own quality system as well as to the IATF16949 and ON Semi requirements.

  1. ON Semi Company Representative (5%)

Delivers a professional representation of ON Semi to the outside world (local and offshore subcontractors) to preserve and heighten ON Semi stature and image as a mature and professional player in the semiconductor industry

Education / Experience

B.S. Engineering/Science graduates with minimum of 8 years’ experience in Process or Packaging Engineering Assembly or Assembly Quality Engineering. Also a minimum of 3 years’ experience in leading a team of engineers globally, experience in communicating with senior management and customer.

Specific Knowledge

Semiconductor (IC, Discreet, Power, SIP and/or module) semiconductor assembly process knowledge, Quality Management and Quality Assurance standards (minimum IATF16949 understanding), Statistical Techniques and Design of Experiment, Equipment/Tooling specific to semiconductor back end assembly, FMEA, Control Plan and APQP. Added advantage if SMT process knowledge, MIL/ITAR requirements, Medical requirements and/or Telecommunication requirements.

Specific Skills

Leadership in taking charge of issues, Interpersonal Skills/Teambuilding Skills, Computer Skills (Basic Power Point, Intermediate Excel, Basic Word), good Communication Skills with minimum ability to speak in English clearly, Negotiation Skills, Problem solving, Technical Writing and Presentation Skills, can interpret technical drawings and common sense to costing.

Specific Attitude

Independent, Professional, Mature, Dependable, Assertive, Decisive, Open-minded, Dynamic, Honest, Quality conscious.

Job: Engineering

Title: External Manufacturing Engineer

Location: CN-CN-Shanghai

Requisition ID: 1803157

ON Semiconductor is an Equal Employment Opportunity Employer and prohibits discrimination on the basis of age, race, color, religion, gender, sexual orientation, national origin, citizenship, protected veteran status, disability status, or any other federal, state or local protected classes. ON is committed to providing equal employment opportunity to qualified individuals, regardless of protect class status.