ON Semiconductor ENGR SR PRIN, PACKAGE DEVELOPMENT_TL in Bucheon, South Korea

Role & Responsibility

  • Technical leader responsible for FE (fabrication front end) & BE (packaging back-end) compatibility for SiC products and packages who possesses a techncial expertize for both FE fabrication material/process/equipment and BE packaging material/process/equipment

Qualification & Requirement

  • Over 10 years experience and expertize in semiconductor power discrete or module products (power device Si or SiC) and packages reserach & development, device engineering, packaging engineering, assembly process and material development

  • Fluent english communication skill

  • Ph.D or master degree preferred with a major of mechanics, material science, metallurgy, chemistry

Job: Engineering


Location: KR-KR-Bucheon-si, Gyeonggi-do

Requisition ID: 1801306

ON Semiconductor is an Equal Employment Opportunity Employer and prohibits discrimination on the basis of age, race, color, religion, gender, sexual orientation, national origin, citizenship, protected veteran status, disability status, or any other federal, state or local protected classes. ON is committed to providing equal employment opportunity to qualified individuals, regardless of protect class status.