ON Semiconductor ENGR SR PRIN, PACKAGE DEVELOPMENT_TL in Bucheon, South Korea

Role & Responsibility

  • Technical leader responsible for FE (fabrication front end) & BE (packaging back-end) compatibility for SiC products and packages who possesses a techncial expertize for both FE fabrication material/process/equipment and BE packaging material/process/equipment

Qualification & Requirement

  • Over 10 years experience and expertize in semiconductor power discrete or module products (power device Si or SiC) and packages reserach & development, device engineering, packaging engineering, assembly process and material development

  • Fluent english communication skill

  • Ph.D or master degree preferred with a major of mechanics, material science, metallurgy, chemistry

Job: Engineering

Title: ENGR SR PRIN, PACKAGE DEVELOPMENTTL_

Location: KR-KR-Bucheon-si, Gyeonggi-do

Requisition ID: 1801306

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