ON Semiconductor SR SUPPLIER QUALITY ENGINEER in Suzhou, China

  1. Investigate, lead, and resolve supplier technical and/or systemic issues resulting in quality issues by identifying the root cause and implementing countermeasures to prevent reoccurrence.

  2. Participate in NPIs and understand customer drawings, specification, functional test and quality expectation and translate them into in-house and suppliers requirement.

  3. Work with internal team to understand the failure defect mechanism, send FA sample to supplier, receive and review supplier FA report. Track return of FA samples if applicable.

  4. Issue and review supplier effectiveness CAR (8D) , follow up on the corrective actions closure

  5. Identify and lead continuous improvement initiatives with suppliers to improve quality, manufacturing efficiencies to add value to our products.

  6. Host weekly/monthly quality meeting with focus suppliers, review quality data and improvement actions.

  7. Perform supplier performance audit, process verification and audit effectiveness of corrective and preventive action

  8. Measure and monitor on-going weekly supplier performance and improvements by providing accurate feedback to both the supplier and the organization

  9. Prepare monthly supplier improvement progress report

  10. Lead quarterly supplier scorecard / rating.

  11. Validate RoHs report from supplier every year.

  12. Provide guidance and training on the use of quality tools such as: control plans, 8D, FMEA, SPC, process capability, and quality measurement systems as required

  13. Develop a close synergy with Strategic Sourcing (Purchasing), New Product Introduction, Manufacturing Quality, Package Development, Manufacturing Engineering as required to collectively support the organization’s strategic initiatives.

  14. Degree holder on Science or Engineering.

  15. Be familiar with QC 7 tools usage, PPAP/APQP/FMEA/MSA/SPC/8D/ESD control procedure and quality system (TS/ISO) relative knowledge.

  16. Good in Written and spoken English language.

  17. Technical background in direct material (eg. lead frame or mold compound) is preferable.

  18. Added advantages experience in packaging design, Die attached, Wire bonding, Molding processes and Packaging Reliability performance knowledge

  19. Able to work with project members such like Package Engineering, SCM, Purchasing, Process Engineering, QA

  20. Experienced packages : Power discrete (like TO220, TO263, D-Pak), and Power module packages (like SPM, APM, IGBT/Diode module).

Job: Engineering

Organization: 580 OU Fairchild Semiconductor (Suzhou) Co., Ltd


Location: CN-CN-Suzhou

Requisition ID: 1705002

ON Semiconductor is an Equal Employment Opportunity Employer and prohibits discrimination on the basis of age, race, color, religion, gender, sexual orientation, national origin, citizenship, protected veteran status, disability status, or any other federal, state or local protected classes. ON is committed to providing equal employment opportunity to qualified individuals, regardless of protect class status.