ON Semiconductor DA PROCESS ENGINEER in Suzhou, China

Duties andResponsibilities

  • Responsible for Soft Solder DA, Epoxy DA and AVI processesfor NPI development projects and post code-s activities

  • Follow projects APQP phase requirements, providedocumentation, line training and respond to internal and externalcustomers

  • Provide technical advice to development engineer/leader (ATPDG and ATNPI technical lead) as well as other cross-functionalteam regarding process design, tooling design and process control toreduce the potential risk items impact to quality, yield, cost and delivery

  • Attend design reviews to brainstorm, analyze, andhighlight design potential risk to mass production

  • Review build diagram of new products and derivativeproducts compliance to design rule specs, manufacturability and lessonslearned

  • Responsible to raise technical constraints whichwill have major impact to project quality, cost, yield,and delivery

  • Responsible to secure POR /BOM to meet NPI and BEmanufacturing KPI requirements

  • Review, validate, accept / rejectdesign concept from the technology group and package development for newproduct introduction from design review APQP Phase zero

  • Review, validate, accept / rejectcharacterized POR (process flow, material and process parameters)established by ATPDG PE based on manufacturing capability on or beforeline certification

  • Ensure project documents, engineeringreports, work-instruction, OCAP procedure, process parameters, bin limit,tooling drawings are reviewed and draft are uploaded to database every phaseas well as finalized before product release

  • Conduct training tomanufacturing, process engineer, technician, operator, and trainerdesignate before line validation or line certification

  • Be responsible to createmitigation plan involving cross-functional team to quickly resolve issuesfound during line certification/safe launch/post code-s for thederivative devices

  • Provide report and share torelated persons closed loop activities for continuous improvement of NPIby lesson learn, Design rule revision and APQP deliverable update

  • Lead the team to use PFMEA/CP/DOE/Red X/Six Sigma asthe continuous improvement tools to improve process capability towardszero defects from development to post code-s monitoring

  • Lead the team to improve NPI process quality, addressthe customer complaints, prevent the recurrence and improve top processPPM defects

  • Involves PE team for post code Sactivities on quality, yield and cost to ensure smooth handover until theproject hands over

  • Host buy off and hands overmeeting with process engineering and cross-functional team to present post code S monitor results of yieldtrends, failure modes with pareto analysis, maverick MRB history, actions,LRR, RMP, compare to Line certification.

  • Responsible to hold MRB meetingwhen for line shut down by maverick, QCN, OCAP, RMP failure potentialfailure mode caused by/potentially caused by owned process and providereport and update together with related document in control database

  • Responsible to generate 8D reportfor PQA related to NPI product released within 2 years under ATNPIpost-code s monitoring

  • Support customer visit, audits and provide data withthe highest priority and urgency

  • Responsible to qualify automotiveprocess and personnel, collaborates with equipment engineering and QA teamto qualify automotive designated equipment.

  • Other responsibility to be assigned based on thebusiness need.

Qualifications

  • Bachelors in Engineering preferably Materials Engineeringor Mechanical Engineering

  • masters degree in engineering or other relateddiscipline is a plus

  • Experience 5 years minimum focused in soft solderdie-attach process

  • 2 years and above experience in sawing process is aplus

  • 2 years and above experience in epoxy die-attach isa plus

  • 2 years and above experience in Auto vision inspection(AVI) process is a plus

  • Can independently do machine set-up and buy-offequipment especially platforms: ESEC2007, ESEC2009, ASM die bonders orother equivalent platforms

  • Have deep understanding and hands-on experience ofsoft solder die-attach process, material, equipment and their interaction

  • Have practical and theoretical knowledge on APQPprocedure, DFMEA, PFMEA, Control Plan, DOE

  • Have good statistical analysis and decision makingskills

  • Confident and fluent in oral and written bothChinese and English (min CET6)

  • Be able to write good technical/engineering report

  • Have good leadership, interpersonal relationship andnegotiation skills

  • Positive attitude towards work, proactive, selfmotivated, open-minded, can work under high pressure

Job: Engineering

Organization: 580 OU Fairchild Semiconductor (Suzhou) Co., Ltd

Title: DA PROCESS ENGINEER

Location: CN-CN-Suzhou

Requisition ID: 1704937

ON Semiconductor is an Equal Employment Opportunity Employer and prohibits discrimination on the basis of age, race, color, religion, gender, sexual orientation, national origin, citizenship, protected veteran status, disability status, or any other federal, state or local protected classes. ON is committed to providing equal employment opportunity to qualified individuals, regardless of protect class status.